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HASL ENIG 10 Layer PCB Blind Buried Holes LED Printed Circuit Board

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Witgain Technology Limited
City:shenzhen
Country/Region:china
Contact Person:MrSteven YU
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HASL ENIG 10 Layer PCB Blind Buried Holes LED Printed Circuit Board

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Brand Name :WITGAIN PCB
Model Number :PCB000386
Certification :UL
Place of Origin :China
MOQ :1pcs/lot
Price :negotiable
Payment Terms :T/T
Supply Ability :100kpcs/Moth
Delivery Time :20 days
Packaging Details :Vacuum package in bubble wrap
Layer Count :10 Layer
Application :Consumer Electronics
Solder Mask :Green Solder Mask
Surface Treatment :Selective Immersion Gold
Drilling :Blind And Buried Holes
TG Degree :TG170
Surface finishing :HASL,ENIG,Gold finger,HASL Lead Free
Product name :Printed Circuit Board
Material :FR4 CEM1 CEM3 Hight TG,FR-4 High TG FR-4 PTFE
Type :Electronic Board
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10 Layer Printed Circuit Board ISO 14001 Qualified Used In Medical Equipment

Main Features:

1 10 Layer customized printed circuit board manufacturered based on customer's gerber files.

2 Used in consumer electronics

3 Material is FR4 S1000-2 TG170.

4 The finished board thickness is 1.0MM.

5 The finished copper thickness is 1/H/H/H/H/H/H/H/H/1 OZ.

6 Surface treatment is ENIG 2U'.

7 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L1-L10 0.2MM, L9-L10 0.1MM, L8-L9 0.1MM Laser Drilling

8 Lead time is around 20 working days.

Material Data Sheet:

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

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