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Green Solder Mask 4 Layer PCB 1.2 MM Thickness 1 OZ Copper 6 Mil

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Witgain Technology Limited
City:shenzhen
Country/Region:china
Contact Person:MrSteven YU
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Green Solder Mask 4 Layer PCB 1.2 MM Thickness 1 OZ Copper 6 Mil

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Brand Name :WITGAIN PCB
Model Number :PCB0031
Certification :UL
Place of Origin :China
MOQ :1 pcs/lot
Price :negotiable
Payment Terms :T/T
Supply Ability :100k pcs/month
Delivery Time :20 days
Packaging Details :Vacuum bubble bag packaging
No of layers :4 Layer
Material :FR4 TG>150
Solder mask colour :Green Solder Mask
PCB Thickness :1.2 MM
Surface technics :ENIG 1U'
Min Lind Space&Width :6/6 mil
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View Product Description

4 Layer PCB 1.2 MM Thickness 1 OZ Copper Green Solder Mask

  • Main Features:


1 4 Layer Printed Circuit Board PCB .
2 Immersion Gold treatment, gold thickness 1u'.
3 FR4 substrate material, tg130 degree.
4 Min line space and width 6/6 mil.
5 Copper thickness is 1 oz on each layer, 35 um on each layer.
6 Green solder mask and white silkscreen.
7 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

  • Our Product Categories:

Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
22 Layer immersion gold +OSP
24 Layer Resin filled in vias


  • FAQ

Q1: What is Soak Testing or Endurance Testing of a PCB Board?

A1: Soak Testing also known as Load Testing or Endurance testing is test performed to check the stability of the PCB over various extreme operating conditions for extended periods of time. For example, a PCB board may perform normally when used for 2 hours, but when the same board is used for 10 hours or more than that, then it may fail. Soak Testing is done to evaluate how the board will operate under different operating conditions for extended periods of time. Soak Testing should be done before the final deployment of the board.





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