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4 Layer Half Hole PCB S1150G Material 1.0 MM Thickness
Board Info:
1 Part NO: Half hole PCB0018
2 Layer Count: 4 Layer PCB
3 Finished Board Thickness: 1.0 MM tolerance is +/-0.1MM
4 Solder Mask: Black
5 Min Lind Space&Width: 4/4 mil
6 Application Area: Blue-tooth Module
7 Drillings: L1-L2 0.1MM, L2-L3 0.15MM, L3-L4 0.1MM, L1-L4 0.2MM Mechanical Drilling
8 PCB Size: 111.95mm*101.93mm/25pcs
9 Material: S1150G
Packing Specifications:
1 One vacuum pcb package should not be over 25 panels based on panel size.
2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.
3 The pcb package must be suitable to ensure effective vacuum sealing.
4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.
5 Humidity indicator card target less than 10%.
X-OUT per panel:
1 X-OUT panel must be packed separately and marked clearly
2 A black X must be permanently marked on both sides of pcb
3 X-OUT per panel not be over 25%
4 X-OUT per lot not be over 5%
Material Data Sheet:
| S1150G | |||||
| Items | Method | Condition | Unit | Typical Value | |
| Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 155 | |
| Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 380 | |
| CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 36 | |
| After Tg | ppm/℃ | 220 | |||
| 50-260℃ | % | 2.8 | |||
| T260 | IPC-TM-650 2.4.24.1 | TMA | min | >60 | |
| T288 | IPC-TM-650 2.4.24.1 | TMA | min | 30 | |
| Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | pass | |
| Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 6.4 x 107 | |
| E-24/125 | MΩ.cm | 5.3 x 106 | |||
| Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 4.8 x 107 | |
| E-24/125 | MΩ | 2.8 x 106 | |||
| Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 140 | |
| Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 45+kV NB | |
| Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.01 | |
| IEC 61189-2-721 | 10GHz | -- | — | ||
| Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
| After thermal Stress 288℃,10s | N/mm | 1.4 | |||
| 125℃ | N/mm | 1.3 | |||
| Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
| CW | IPC-TM-650 2.4.4 | A | MPa | 450 | |
| Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
| CTI | IEC60112 | A | Rating | PLC 0 | |
| Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
| E-24/125 | Rating | V-0 | |||