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Printed Circuit Boards 8 Layer PCB With 100 Ohm
PCB Specifications:
1 Board layers 8 layer see layer stackup
2 Board material laminate should be 0.031inch +/-10%
3 Finished glass epoxy laminate, type nema grade or equivalent
4 Outer layer to be 0.5OZ Copper clad
5 Construction should meet class 94v-0
6 Layer construction alignment max: +-0.05mm
Our Product Ranges:
Our Product Categories | ||
Material Kinds | Layer Counts | Treatments |
FR4 | Single Layer | HASL Lead Free |
CEM-1 | 2 Layer/Double Layer | OSP |
CEM-3 | 4 Layer | Immersion Gold/ENIG |
Aluminum Substrate | 6 Layer | Hard Gold Plating |
Iron Substrate | 8 Layer | Immersion Silver |
PTFE | 10 Layer | Immersion Tin |
PI Polymide | 12 Layer | Gold fingers |
AL2O3 Ceramic Substrate | 14 Layer | Heavy copper up to 8OZ |
Rogers, Isola high frequency materials | 16 Layer | Half plating holes |
Halogen free | 18 Layer | HDI Laser drilling |
Copper based | 20 Layer | Selective immersion gold |
22 Layer | immersion gold +OSP | |
24 Layer | Resin filled in vias |
Multilayer PCB Process: