Witgain Technology Limited
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6 Layer PCB TG 150 FR4 Substrate Material Used In Earphone
Printed Circuit Board Features:
1 6 Layer printed circuit board used in earphone
2 FR4 substrate material, tg 150 degree.
3 Black solder mask and white silkscreen.
4 ENIG, gold thickness 2U'
5 Finished pcb thickness 1.2mm.
6 35 um copper thcikness on each layer.
7 PCB file or gerber file should be offered by customer.
8 Customized printed circuit board.
9 Epoxy filled in vias.
Our history:
Our Capabilities:
| NO | Item | Capability |
| 1 | Layer Count | 1-24 Layers |
| 2 | Board Thickness | 0.1mm-6.0mm |
| 3 | Finished Board Max Size | 700mm*800mm |
| 4 | Finished Board Thickness Tolerance | +/-10% +/-0.1(<1.0mm) |
| 5 | Warp | <0.7% |
| 6 | Major CCL Brand | KB/NanYa/ITEQ/ShengYi/Rogers Etc |
| 7 | Material Type | FR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET |
| 8 | Drill Hole Diameter | 0.1mm-6.5mm |
| 9 | Out Layer Copper Thickness | 1/2OZ-8OZ |
| 10 | Inner Layer Copper Thickness | 1/3OZ-6OZ |
| 11 | Aspect Ratio | 10:1 |
| 12 | PTH Hole Tolerance | +/-3mil |
| 13 | NPTH Hole Tolerance | +/-1mil |
| 14 | Copper Thickness of PTH Wall | >10mil(25um) |
| 15 | Line Width And Space | 2/2mil |
| 16 | Min Solder Mask Bridge | 2.5mil |
| 17 | Solder Mask Alignment Tolerance | +/-2mil |
| 18 | Dimension Tolerance | +/-4mil |
| 19 | Max Gold Thickness | 200u'(0.2mil) |
| 20 | Thermal Shock | 288℃, 10s, 3 times |
| 21 | Impedance Control | +/-10% |
| 22 | Test Capability | PAD Size min 0.1mm |
| 23 | Min BGA | 7mil |
| 24 | Surface Treatment | OSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc |