Witgain Technology Limited
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4 Layer PCB With Half Plated Holes Used In GPS Module
Board Requirements:
1. Board Laminate:
Board layers 4 layer see layer stackup
Board material laminate should be 0.031inch +/-10%
Finished glass epoxy laminate, type nema grade or equivalent
Outer layer to be 0.5OZ Copper clad
Construction should meet class 94v-0
Layer construction alignment max: +-0.05mm
2 Holes:
Copper plate through all holes with a minimum wall thickness of 0.0254mm
Register tolerance : +-0.015mm
All holes must be drilled +-0.051mm with respect to center of drilled pad
3 Solder mask:
Liquid photo-imageable solder mask over bare copper per IPC-SM-840,TYPE B,CLASS3
4. Finish:
4.1 Copper plated through all holes
4.2 All other exposed conductive pattern areas not covered with solder mask shall be plated with ENIG(ELECTROLESS NICKEL IMMERSION GOLD) at a minimum of 0.05 micron thickness of hard gold over 3.0 to 6.0 micron thick electroless nickel plating
5 Board outline can not be violated. Board outline shall be free from tough edge, mouse bite etc.
6 This pcb must comply with the material restrictions for ROHS directive 2011/65/eu and amending directive 2015/863.
