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Half Hole PCB 4 Layer HDI PCB 0.8MM IT180A Material
Board Info:
1 Part NO: Half hole PCB0012
2 Layer Count: 4 Layer PCB
3 Finished Board Thickness: 0.8 MM tolerance is +/-0.1MM
4 Solder Mask: Green
5 Min Lind Space&Width: 3.5/3.5 mil
6 Application Area: Blue-tooth Module
7 Drillings: L1-L2 0.1MM Laser drilling, L3-L4 0.1MM Laser Drilling, L1-L4 0.2MM Mechanical Drilling
8 BGA Size: 0.2MM, Laser drilling on BGA PAD and plated flat
Applications:
Automotive (Engine room ECU)
Multilayer and HDI PCB
Backplanes
Data Storage
Server and Networking
Telecommunications
Heavy Copper
IT180A Data Sheet:
| Items | IPC TM-650 | Typical Value | Unit |
| Peel Strength, minimum A. Low profile copper foil B. Standard profile copper foil |
2.4.8 | 5 8 |
lb/inch |
| Volume Resistivity | 2.5.17.1 | 1x109 | M-cm |
| Surface Resistivity | 2.5.17.1 | 1x108 | M |
| Moisture Absorption, maximum | 2.6.2.1 | 0.10 | % |
| Permittivity (Dk, 50% resin content) A. 1MHz B. 1GHz |
2.5.5.9 2.5.5.9 |
4.5 4.4 |
-- |
| Loss Tangent (Df, 50% resin content) A. 1MHz B. 1GHz |
2.5.5.9 2.5.5.9 |
0.014 0.015 |
-- |
| Flexural Strength, minimum A. Length direction B. Cross direction |
2.4.4 | 500-530 410-440 |
N/mm2 |
| Thermal Stress 10 s at 288°C A. Unetched B. Etched |
2.4.13.1 | Pass Pass | Rating |
| Flammability | UL94 | V-0 | Rating |
| Comparative Tracking Index (CTI) | IEC 60112 / UL 746 | CTI 3 (175-249) | Class (Volts) |
| Glass Transition Temperature(DSC) | 2.4.25 | 175 | ˚C |
| Decomposition Temperature | 2.4.24.6 | 345 | ˚C |
| X/Y Axis CTE (40℃ to 125℃) | 2.4.41 | 11-13 / 13-15 | ppm/˚C |
| Z-Axis CTE A. Alpha 1 B. Alpha 2 C. 50 to 260 Degrees C |
2.4.24 | 45 210 2.7 |
ppm/˚C ppm/˚C % |
| Thermal Resistance A. T260 B. T288 |
2.4.24.1 | >60 20 |
Minutes Minutes |