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Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate

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Witgain Technology Limited
City:shenzhen
Country/Region:china
Contact Person:MrSteven YU
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Matte Green Solder HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate

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Brand Name :WITGAIN PCB
Model Number :HDIPCB0015
Certification :UL
Place of Origin :China
MOQ :1pcs/lot
Price :negotiable
Payment Terms :T/T
Supply Ability :100kpcs/Month
Delivery Time :25 days
Packaging Details :vacuum package in bubble wrap
Layer Count :10 Layer
Board Thickness :1.6MM
PCB Kind :HDI PCB
Min Hole :0.1MM
Impedance Control :50 Ohm
Surface Treatment :Immersion Gold 3U'
Size :154mm*143mm/1pcs
BGA Size :16 MIL
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HDI PCB 10 Layer 1.6 MM Thickness FR4 Substrate Green Solder Mask

PCB Specifications:

1 Part NO: HDIPCB0014

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 2+N+2 Drilling: L1-L2 0.1MM, L2-L3 0.1MM, L2-L9 0.2MM,L8-L9 0.1MM, L9-L10 0.1MM, L1-L100.2MM

5 Min Lind Space&Width:5/5mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Automobile

8 PCB Size: 154mm*143mm/1pcs

9 PCB Drawing File Size: Gerber File

X-OUT per panel:

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

S1000-2 Data Sheet:

S1000-2
Items Method Condition Unit Typical Value
Tg IPC-TM-650 2.4.25 DSC 180
IPC-TM-650 2.4.24.4 DMA 185
Td IPC-TM-650 2.4.24.6 5% wt. loss 345
CTE (Z-axis) IPC-TM-650 2.4.24 Before Tg ppm/℃ 45
After Tg ppm/℃ 220
50-260℃ % 2.8
T260 IPC-TM-650 2.4.24.1 TMA min 60
T288 IPC-TM-650 2.4.24.1 TMA min 20
T300 IPC-TM-650 2.4.24.1 TMA min 5
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip -- 100S No Delamination
Volume Resistivity IPC-TM-650 2.5.17.1 After moisture resistance MΩ.cm 2.2 x 108
E-24/125 MΩ.cm 4.5 x 106
Surface Resistivity IPC-TM-650 2.5.17.1 After moisture resistance 7.9 x 107
E-24/125 1.7 x 106
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-4/23 s 100
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-4/23 kV 63
Dissipation Constant (Dk) IPC-TM-650 2.5.5.9 1MHz -- 4.8
IEC 61189-2-721 10GHz --
Dissipation Factor (Df) IPC-TM-650 2.5.5.9 1MHz -- 0.013
IEC 61189-2-721 10GHz --
Peel Strength (1Oz HTE copper foil) IPC-TM-650 2.4.8 A N/mm
After thermal Stress 288℃,10s N/mm 1.38
125℃ N/mm 1.07
Flexural Strength LW IPC-TM-650 2.4.4 A MPa 562
CW IPC-TM-650 2.4.4 A MPa 518
Water Absorption IPC-TM-650 2.6.2.1 E-1/105+D-24/23 % 0.1
CTI IEC60112 A Rating PLC 3
Flammability UL94 C-48/23/50 Rating V-0
E-24/125 Rating V-0

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